Deep UV stepper lithography
Nanolab runs a Canon FPA-3000EX4 DUV Stepper Lithography tool with critical dimension of 250nm on arbitrary shapes and down to 180nm lines and spaces with optimized illumination.
The tool runs with 248nm light and has a maximum printing field size of 22 x 26, the original reticle (mask) feature size is reduced by a factor 5.
Substrate size can be 100mm, 150mm and 200mm wafers.
Standard substrate size is 150mm wafers where the maximum throughput can be up to 60 wafers per hour.
The DUV tool is accompanied by a fully automated cassette to cassette spinner (Karl Süss gamma series). The tool is equiped with 3 resist lines (BARC, thin chemically amplified resist (300nm – 600nm), thick chemically amplified resist (800nm-1600nm)). In addition spinning of negative resist (200nm to 1400nm) is possible.
A fully automated cassette to cassette developer (Karl Süss gamma series) using 2,38% TMAH in water for developing DUV resists is collocated in the same room with the stepper and the aforementioned spinner.
The tool runs with 248nm light and has a maximum printing field size of 22 x 26, the original reticle (mask) feature size is reduced by a factor 5.
Substrate size can be 100mm, 150mm and 200mm wafers.
Standard substrate size is 150mm wafers where the maximum throughput can be up to 60 wafers per hour.
The DUV tool is accompanied by a fully automated cassette to cassette spinner (Karl Süss gamma series). The tool is equiped with 3 resist lines (BARC, thin chemically amplified resist (300nm – 600nm), thick chemically amplified resist (800nm-1600nm)). In addition spinning of negative resist (200nm to 1400nm) is possible.
A fully automated cassette to cassette developer (Karl Süss gamma series) using 2,38% TMAH in water for developing DUV resists is collocated in the same room with the stepper and the aforementioned spinner.
