Etch

Dry etch
A total of 8 plasma based dry etch tools are available 

Among them cassette to cassette tools for etching of silicon (100mm and 150mm wafers respectively)
(a cassette to cassette tool for etching silicon based dielectrics on 150mm wafers is clustered together with the 150mm silicon tool):

• Dedicated ICP tools for silicon based dielectrics (silicon oxide, silicon nitride, silicon oxynitrides).
• Dedicated ICP tool for metal etch (such as Al, Cr, Ti, Mb, W, and some of their related oxides and nitrides).
• Dedicated ICP tool for III V materials such as GaAs, InP, GaN, AlGaAs, InGaAs, InGaAsP.
• Possibility to etch polymers such as polyimide, PDMS, PMMA, BCB and resists.

Wet etch
Our wet etch capabilities include several etch baths and the following materials are wet etched on a regular basis: Silicon Nitride, Silicon Oxide, Silicon (isotropic), Silicon (anisotropic), Aluminium Chromium, Titanium, Gold, Platinum, various III-V compounds.