Dry etch
A total of 8 plasma based dry etch tools are available
- Among them cassette to cassette tools for etching of silicon (100mm and 150mm wafers respectively)
- (a cassette to cassette tool for etching silicon based dielectrics on 150mm wafers is clustered together with the 150mm silicon tool)
- Dedicated ICP tools for silicon based dielectrics (silicon oxide, silicon nitride, silicon oxynitrides).
- Dedicated ICP tool for metal etch (such as Al, Cr, Ti, Mb, W, and some of their related oxides and nitrides).
- Dedicated ICP tool for III V materials such as GaAs, InP, GaN, AlGaAs, InGaAs, InGaAsP.
- Possibility to etch polymers such as polyimide, PDMS, PMMA, BCB and resists.
Wet etch
Our wet etch capabilities include several etch baths and the following materials are wet etched on a regular basis: Silicon Nitride, Silicon Oxide, Silicon (isotropic), Silicon (anisotropic), Aluminium Chromium, Titanium, Gold, Platinum, various III-V compounds.