Packaging and back end (outside main cleanroom)
Dicing saw
Wafer dicing saw
Substrate up to 150mm
Max blade size: 76,2mm diameter
Not suited/ currently set up for: Thick metals (> 750µm), III-V samples
Wire bond
Manual or ball wire bonding with gold and aluminium wires
Semiautomatic gold ball bonding.
25µm wires Al, Au and Au ribbon(100 x 20µm)
Min bonding areas:
100µm x 100µm ball bonding
200µm x 200µm wedge bonding
Recommended temperature 120°C
Laser micromachining
DTU Nanolab runs an industrial grade Laser Micromachining Tool (microSTRUCT vario from 3D-Micromac AG). The tool is equipped with a 40W tunable pico/femtosecond (344nm, 515nm, 1030nm) Carbide laser.
Micromachining and dicing of materials such as: Si, Si +Si3N4 and /or Si O2, silicon with resist, Aluminium, Steel, Pyrex, COC polymers (Topas), Nickel, Tungsten, among others
Laser wavelengths: 344nm, 515nm, 1030nm repetition rates up to 200kHz, power up to 40W
Resolution down to 10µm (344nm)
Max writing area: 165mm x 165 mm (515nm, 1030nm), 145mm x 145mm (344 nm) without stitching (moving the sample)
Stad sample Cleaning procedures
Wafer dicing saw
Substrate up to 150mm
Max blade size: 76,2mm diameter
Not suited/ currently set up for: Thick metals (> 750µm), III-V samples
Wire bond
Manual or ball wire bonding with gold and aluminium wires
Semiautomatic gold ball bonding.
25µm wires Al, Au and Au ribbon(100 x 20µm)
Min bonding areas:
100µm x 100µm ball bonding
200µm x 200µm wedge bonding
Recommended temperature 120°C
Laser micromachining
DTU Nanolab runs an industrial grade Laser Micromachining Tool (microSTRUCT vario from 3D-Micromac AG). The tool is equipped with a 40W tunable pico/femtosecond (344nm, 515nm, 1030nm) Carbide laser.
Micromachining and dicing of materials such as: Si, Si +Si3N4 and /or Si O2, silicon with resist, Aluminium, Steel, Pyrex, COC polymers (Topas), Nickel, Tungsten, among others
Laser wavelengths: 344nm, 515nm, 1030nm repetition rates up to 200kHz, power up to 40W
Resolution down to 10µm (344nm)
Max writing area: 165mm x 165 mm (515nm, 1030nm), 145mm x 145mm (344 nm) without stitching (moving the sample)
Hot embossing
The Hot Embossing at DTU Nanolab is a hydraulic machine, a Collin Press P300 SV from Collin Lab & Pilot Solutions.
Main usage: Hot embossing and thermal bonding
Temperature up to 285°C
Samples and up to 200mm wafers
Currently allowed materials: Topas 5013L-10, Topas 8007S-04, PP, PMMA, PC, PCL, SU8, Al, Ni, Graphene
Stad sample Cleaning procedures